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Laser Marking: A Comprehensive Guide

The silicon wafer manufacturing process relies heavily on laser marking. An optical laser machine uses a focused beam of light in order to make a permanent mark on semiconductor packages.

Lasers produce focused and directed light particles by stimulating atoms with light. Laser stands for “Light Amplification by Stimulated Emission of Radiation.” Marking can be accomplished with precision by using a laser marking machine.

Tracking wafers throughout production is possible with laser marking. It is therefore necessary to automatically read the laser markings. Furthermore, it must be detailed so that the marking does not adversely affect the processes underneath, and the wafer is not damaged. Perfect maintenance is essential.

Wafer World offers silicon wafer laser marking services as part of its entire process.

What is the process of making silicon wafers?

Laser marking is what it sounds like. Wafers are marked with lasers to identify them. Almost all electronic devices use wafers, just like semiconductors. The wafers are circular, glossy, and flat.

It is extremely important to ensure silicon wafers remain faultless during Znakowanie laserowe marking since they have no impurities.

Characteristics of laser beams

In order to fabricate silicon wafers with the utmost precision, lasers are the most effective tool. A laser beam used for marking has the following features in addition to these:

  • Monochromatic patterns use a single color
  • Light waves have both a spatial and temporal phase

Laser-assisted annexes

An annealing process uses a laser beam for extremely efficient heating of surfaces. When the surface is heated (oxidized), oxygen diffuses beneath the surface. This causes a change in color when everything is cooled.

Colors can be produced by annealing a material, including yellow, red, and green. These colors change according to the changes in temperature during marking. If the temperature increases or decreases, it is determined by three factors:

  • Intensity of a pulse
  •  The speed of light
  • Each line passes through the other

It is possible to render characters shorter than one millimeter using these lasers. Annealing silicon-based wafers is a popular process that produces excellent results using lasers.

Introducing Laser Marking

Marking silicon wafers requires the use of computers. Wafer mapping is contained in the marking document at this point in the manufacturing process. These documents provide information on the corresponding parameters, functions, etc. A preview view of how the data will be translated into silicon can be found on the other side of the screen.

The wafer will be placed on the laser marking machine after everything has been setup correctly. Marking is carried out by bringing the wafer to a mechanical hand. This will be a completely automated process, without any human interaction required.

When the machine has located its target location, it will aim the laser at the wafer surface. Upon completion, the project will be transported to a receiving box, from which it can be removed.

The advantages of laser marking are numerous

High-quality

It is an excellent method of marking wafers due to its precision. The advanced technology ensures that even the smallest details will always be clearly detailed and accurate. For tracking silicon wafers, computers can read markings smaller than a millimeter.

Rapid

Furthermore, laser marking is extremely fast, as well as being extremely precise. Whole silicon wafer stacks can be marked in minutes, from placement to marking to completion. While laser annealing is slower than conventional annealing, it provides an incredible finish without leaving any traces behind.

Surface-only application

Laser marking does not remove any material from a silicon wafer’s surface. Instead, it changes the colors under the surface of the silicon. A continuous, perfect surface is maintained.

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